Indium Corporation to Showcase Innovative Materials at Wafer-Level Packaging Symposium

 

Indium Corporation to Showcase Innovative Materials at Wafer-Level Packaging Symposium

Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr Dongkai Shangguan, strategic advisor, at the Surface Mount Technology Association’s Wafer-Level Packaging Symposium, Feb. 15-17, San Jose, Calif., U.S. Indium Corporat… 

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