HIGH DENSITY INTERCONNECT PCB

HDI PCB (HIGH DENSITY INTERCONNECT ) 1 + N + 1

hdi 01HIGH DENSITY INTERCONNECT PCB

Material:FR-4 High Tg

Board Thickness:1.6mm

Layers:6 Layers

Surface Finished:ENIG (Electroless Nickel Immersion Gold)

Copper Weight:1.0 oz.

HDI (HIGH DENSITY INTERCONNECT) 1 + N + 1

Laser Drill / Vias are plating and filled with copper:L1 – L2

hdi 02

HDI PCB (HIGH DENSITY INTERCONNECT) 2 + N + 2

hdi 03

Material:FR-4 High Tg

Board Thickness:1.2mm

Layer:10 Layers

Surface Finished:ENIG:2μ” / 150μ”
(Electroless Nickel Immersion Gold)

Copper Weight:1.0 oz

HDI (HIGH DENSITY INTERCONNECT) 1 + N + 1

Laser Drill / Vias are plating and filled with copper:L1 – L2

hdi 2 1


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