Impact of active and passive component shortages on electronics manufacturers!

Impact of active and passive component shortages on electronics manufacturers!
Temporary or continuous?

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Although COVID-19 has impacted the development of many industries, it has also boosted the past glory of some industries. Just a few months after the outbreak in 2020, a rush for components arose in the electronics industry.

  The rise of work from home and the stay-at-home economy as a result of COVID-19 boosted desktop and laptop sales and raised the demand for panel driver ICs, power control ICs, and CUPs in 2020H1. Alongside the rise of smartphone replacement after system upgrading to 5G which requires many times more components than 4G, camera, panel, and power management ICs and I/O control components were all out of stock. When the e-learning demand rose in some countries in 2020H2, orders for tens of millions of laptops dropped in to aggravate material shortages. Due to the lower demand at the beginning of the pandemic, automotive chip orders were cut. As the recovery of the automotive market was faster than expected, and the capacity of manufacturers was quickly consumed the electronics industry, a total chip shortage occurred in the automotive industry. Governments of the world, including Germany, Japan, and the USA, thus asked manufacturers to boost capacity through the government of Taiwan, which was a rare phenomenon.

  In 2021, the delivery lead-time of some IC chips increased from 12–16 weeks to 52 weeks. Although some orders were accepted, manufacturers could not confirm the delivery time, and some manufacturers even rejected new orders. Although the undersupply of some components became less severe since August compared to the beginning of the year, it still took 20–24 weeks to fill orders, except for grabbing in-stock products at higher prices. Besides surviving from the pressure of the rapidly rising material cost in the first half of the year, electronics manufacturers must continue to suffer this endless material shortage crisis. Currently, the production schedule of many products has either been delayed or suspended by the active and passive component shortage, and no one knows if this global material shortage crisis is temporary or will continue.

   As most PCB manufacturers provide only PCB manufacturing services, and customers must seek SMT service providers to finish their products, thus fragmenting and prolonging the procurement process. Many customers having faith in our quality for years have asked if we could take PCBA orders. In view of this rising demand, we have specifically increased the electronic component brokerage and SMT OEM services, hoping to help more customers simplify and smoothen their procurement process with these two new service items.

   We have access to purchasing the following brands of active and passive components. You are welcome to contact us for more information.

Purpose of Hot Air Solder Leveling

The purpose is to immerse the semi-finished board applied with solder mask in the molten tin to let the hole wall and the bare copper bonding pad be coated by the solder, immediately pull it out of the tin tank (transported through roller), and then let two hot air knifes blow off the solder in the holes with high pressure hot winds while the hole wall and the bonding pad can still be coated with a solder layer that helps with soldering.

Principle of the Process

3-1 Vertical Hot Air Solder Leveling Process

Feeding → pre-treatment cleaning → immersing flux → spraying tin → post treatment cleaning → quality inspection → packaging

3-2 Horizontal Hot Air Solder Leveling Process

Feeding → pre-treatment cleaning → preheating → immersing flux → halfway inspection → spraying tin → air-floating cooling bed → post treatment cleaning → quality inspection → packaging

3-3 Pre-treatment Cleaning

1.Copper etching of 15–25 µin.

2.The main function is cleaning the copper surfaces, etching the thin layer of copper surface with sulfuric acid hydrogen peroxide to fully remove the organic pollutant on the surface, so that the clean copper surface can react with molten tin and successfully form the IMC.

Purpose of Hot Air Solder Leveling

The purpose is to immerse the semi-finished board applied with solder mask in the molten tin to let the hole wall and the bare copper bonding pad be coated by the solder, immediately pull it out of the tin tank (transported through roller), and then let two hot air knifes blow off the solder in the holes with high pressure hot winds while the hole wall and the bonding pad can still be coated with a solder layer that helps with soldering.

Principle of the Process

3-1 Vertical Hot Air Solder Leveling Process

Feeding → pre-treatment cleaning → immersing flux → spraying tin → post treatment cleaning → quality inspection → packaging

3-2 Horizontal Hot Air Solder Leveling Process

Feeding → pre-treatment cleaning → preheating → immersing flux → halfway inspection → spraying tin → air-floating cooling bed → post treatment cleaning → quality inspection → packaging

3-3 Pre-treatment Cleaning

1.Copper etching of 15–25 µin.

2.The main function is cleaning the copper surfaces, etching the thin layer of copper surface with sulfuric acid hydrogen peroxide to fully remove the organic pollutant on the surface, so that the clean copper surface can react with molten tin and successfully form the IMC.

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